Location: Schloss Biebrich Wiesbaden, Rheingaustraße 140, 65203 Wiesbaden
In late autumn, the Logistics and SCM Summit invites decision-makers from departments of logistics, SCM, transportation, materials management and purchasing to address the issues and questions of the future "Industry 4.0": Which challenges of the digital transformation have to be overcome? How can the logistics value chain be set up for the future? What other strategies and processes will be put to the test? How can my company successfully position itself for the future?
Packaging solutions are the future-oriented companions of industry 4.0. Meet THIMM at the Logistics and SCM Summit in Wiesbaden and talk with our experts. Discover new impulses in the packaging world and ask us your questions.
Further information is available at https://www.dialogum.de/wirtschaftsgipfel/logistik-scm-gipfel